September 30, 2016 / 7:31 AM / a year ago

BRIEF-EugeneTechnology signs contract worth 2.41 bln won

Sept 30 (Reuters) - EugeneTechnology Co Ltd :

* Says it signs contract with Winbond Electronics Corporation, to supply semiconductor manufacture equipment

* Contract amount of 2.41 billion won

Source text: goo.gl/6Xaxnh

Further company Coverage: (Beijing Headline News)

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