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BRIEF-Kingfa Sci & Tech plans bond issue, sets up insurance jv
December 26, 2016 / 11:48 AM / 9 months ago

BRIEF-Kingfa Sci & Tech plans bond issue, sets up insurance jv

Dec 26 (Reuters) - Kingfa Sci & Tech Co Ltd

* Says it plans to issue up to 2.0 billion yuan ($287.85 million) medium-term notes, 3.0 billion yuan bonds

* Says it plans to invest 110 million yuan to set up insurance jv with partners

Source text in Chinese: bit.ly/2hZ3ALq ; bit.ly/2iwfJnY ; bit.ly/2i7gOUz

Further company coverage: ($1 = 6.9480 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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