UPDATE 2-Qualcomm, others found to infringe Tessera patents

* Patents involve packaging of electronic chips

* ITC prohibits some imports, issues cease/desist order

* Qualcomm disappointed, counsel mentions appeal option (Adds Tessera and Qualcomm reaction, background on dispute, byline)

By Diane Bartz

WASHINGTON, May 20 (Reuters) - Qualcomm (QCOM.O), Motorola (MOT.N) and others infringed Tessera Technologies' (TSRA.O) patents for methods to package semiconductor chips so they are protected inside portable devices, the U.S. International Trade Commission said on Wednesday.

The commission issued an order to prohibit importation of chips which infringe the Tessera patents. It also issued a cease and desist order to stop infringement.

Tessera's suit was against ATI Tech, a unit of Advanced Micro Devices (AMD.N); Freescale Semiconductor [FSLSM.UL]; Motorola; Qualcomm; ST Microelectronics N.V.; Spansion Inc (SPSNQ.PK) and Spansion LLC.

Qualcomm, a wireless chip supplier, has said that it had previously purchased its chip packaging from a variety of suppliers but has now shifted to buying all of them from Amkor Technology (AMKR.O), which licenses technology from Tessera.

Motorola, which has struggled in recent years to stem sharp market share declines, has reached a deal with Tessera to enter into a pre-negotiated license to use the technology.