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Taiwan's Advanced Semiconductor launches $400 mln convertible bond-terms
August 29, 2013 / 7:07 AM / 4 years ago

Taiwan's Advanced Semiconductor launches $400 mln convertible bond-terms

HONG KONG, Aug 29 (Reuters) - Taiwan’s Advanced Semiconductor Engineering Inc plans to raise $400 million selling convertible bonds due 2018, according to a term sheet of the deal seen by Reuters on Thursday.

The zero-coupon bonds were launched with an initial conversion price of T$32.45 to T$34.36, according to the term sheet.

Citigroup Inc was hired as sole global coordinator for the offering, with CIMB, Credit Suisse and DBS acting as joint bookrunners, the term sheet showed.

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