Company Profile For STATS ChipPAC Limited

STATS ChipPAC Ltd. is a service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. The Company’s services include packaging services, test services, and pre-production and post-production services. It offers semiconductor packaging and test services to the semiconductor industry for applications in communications, computing, consumer, automotive and industrial markets. The Company offers backend turnkey services from wafer probe to final test and drop ship. The services offered are customized to the needs of its individual customers. During the fiscal year ended December 28, 2008 (fiscal 2008), 74.5% of its net revenues were derived from packaging services, and 25.5% of its net revenues were derived from test and other services.

BRIEF: For the six months ended 28 June 2009, STATS ChipPACLtd.'s revenues decreased 37% to $541.2M. Net loss totaled $48.8M vs. an income of $40M. Revenues reflect a decrease in income from company's products and sales. Net loss reflects higher restructuring charges, other operating loss vs. an income, lower gross profit margins and the presence of foreign currency exchange loss vs. an income.