February 9, 2018 / 8:22 AM / 13 days ago

BRIEF-Beijing Xinwei Technology To Issue Up To 2.0 Billion Yuan Bonds

Feb 9 (Reuters) - Beijing Xinwei Technology Group Co Ltd :

* SAYS IT PLANS TO ISSUE UP TO 2.0 BILLION YUAN ($317.63 million) BONDS Source text in Chinese: bit.ly/2EbLX3q Further company coverage: ($1 = 6.2966 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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