May 2, 2018 / 9:35 AM / 6 months ago

BRIEF-Hangzhou Silan Microelectronics Plans To Issue Up To 800 Mln Yuan Bonds

May 2 (Reuters) - Hangzhou Silan Microelectronics Co Ltd :

* SAYS IT PLANS TO ISSUE UP TO 800 MILLION YUAN ($125.81 million) BONDS Source text in Chinese: bit.ly/2I32fkj Further company coverage: ($1 = 6.3587 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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