January 19, 2018 / 6:49 AM / 7 months ago

BRIEF-Hulic to issue hybrid bonds worth 50 bln yen

Jan 19 (Reuters) - Hulic Co Ltd

* Says it will issue hybrid bonds worth 50 billion yen with interest rate of 0.99 percent(during the period from Jan. 26, 2018 to Jan. 26, 2023)

* Maturity date on Jan. 26, 2053

* Payment date on Jan. 26, 2018

* Mizuho Securities Co., Ltd., Nomura Securities Co., Ltd., Daiwa Securities Co.Ltd. and SMBC Nikko Securities Inc. will serve as underwriters

Source text in Japanese:goo.gl/hJZTe2

Further company coverage: (Beijing Headline News)

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