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BRIEF-Kuangda Technology gets regulatory approval for bonds issue
May 9, 2017 / 7:52 AM / 7 months ago

BRIEF-Kuangda Technology gets regulatory approval for bonds issue

May 9 (Reuters) - Kuangda Technology Group Co Ltd

* Says it gets securities regulator’s approval to issue up to 950 million yuan ($137.54 million) bonds

Source text in Chinese: bit.ly/2ql8dV7

Further company coverage: ($1 = 6.9073 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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