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BRIEF-Radium Life Tech to issue 2017 1st tranche corporate bonds worth T$1 bln
September 1, 2017 / 6:59 AM / 4 months ago

BRIEF-Radium Life Tech to issue 2017 1st tranche corporate bonds worth T$1 bln

Sept 1(Reuters) - Radium Life Tech Co Ltd :

* Says it plans to issue 2017 1st tranche 5-year secured corporate bonds worth T$1 billion with coupon rate of 1.02 percent

Source text in Chinese: goo.gl/TK1Zv7

Further company coverage: (Beijing Headline News)

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