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BRIEF-Shanghai Fudan Microelectronics announces placing of new H shares
September 29, 2017 / 3:19 PM / 20 days ago

BRIEF-Shanghai Fudan Microelectronics announces placing of new H shares

Sept 29 (Reuters) - Shanghai Fudan Microelectronics Group Co Ltd

* Placing of new H shares under general mandate

* Company and placing agent entered into placing agreement

* Company conditionally agreed to issue placing shares

* Aggregate net proceeds from placing are expected to be approximately HK$218.4 million Source text for Eikon: Further company coverage:

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