April 26, 2018 / 11:42 AM / a month ago

BRIEF-Suzhou Jinfu Technology plans Bonds for Innovation and Entrepreneurship worth up to 1 bln yuan

April 26 (Reuters) - Suzhou Jinfu Technology Co Ltd :

* Says it plans to issue up to 1 billion yuan non-public Bonds for Innovation and Entrepreneurship

Source text in Chinese: goo.gl/6kVo9C

Further company coverage: (Beijing Headline News)

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