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BRIEF-Suzhou New District Hi-Tech Industrial plans bond issue, unit to set up firm
September 29, 2017 / 8:33 AM / 2 months ago

BRIEF-Suzhou New District Hi-Tech Industrial plans bond issue, unit to set up firm

Sept 29 (Reuters) - Suzhou New District Hi-Tech Industrial Co Ltd

* Says it plans to issue 2.0 billion yuan ($301.01 million) bonds, 1.0 billion yuan green bonds

* Says unit plans to invest 500 million yuan to set up property development firm

Source text in Chinese: bit.ly/2yxu5wL; bit.ly/2xCoIzg; bit.ly/2xGypud

Further company coverage: ($1 = 6.6444 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

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