Technology, Media and Telecommunications

April 20, 2018 / 2:59 AM / 3 months ago

BRIEF-Techwing signs contract worth 3.31 bln won

Reuters Staff

1 Min Read

April 20(Reuters) - Techwing Inc :

* Says it signs 3.31 billion won contract to provide semiconductor inspection equipment

Source text in Korean: goo.gl/J8yVGz

Further company coverage: (Beijing Headline News)

Our Standards:The Thomson Reuters Trust Principles.

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