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BRIEF-TECOM to issue T$60 mln non-public corporate bonds
November 9, 2017 / 7:36 AM / a month ago

BRIEF-TECOM to issue T$60 mln non-public corporate bonds

Nov 9 (Reuters) - TECOM Co Ltd :

* Says it plans to issue 2017 1st tranche non-public unsecured corporate bonds worth T$60 million in total, with coupon rate of 1.8 percent per annum

* Proceeds will be used to improve the financial structure and fulfill working capital

Source text in Chinese: goo.gl/DxzGfm

Further company coverage: (Beijing Headline News)

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