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BRIEF-Techwing signs 2.76 bln won contract with SanDisk
December 15, 2016 / 4:06 AM / a year ago

BRIEF-Techwing signs 2.76 bln won contract with SanDisk

Dec 15 (Reuters) - Techwing Inc :

* Says it signs 2.76 billion won contract with SanDisk to provide memory semiconductor’s inspection equipment system

* Says the contract period from Dec. 14 to Mar. 24, 2017

Source text in Korean: goo.gl/uiiVNs

Further company coverage: (Beijing Headline News)

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