Sharingtechnology to take out loan and issue corporate bonds
Dec 14 (Reuters) - Sharingtechnology Inc <3989.T> ::Says it plans to take out a 5-yr term loan of 3.25 billion yen from banks on Dec. 15.Co plans to issue the second series and the third series unsecured corporate bonds on Dec. 25, worth totaling 1 billion yen, to fulfill working capital .
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