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Hangzhou Silan Microelectronics Co., Ltd

600460.SS

Latest Trade

14.58CNY

Change

-0.41(-2.74%)

Volume

25,892,518

Today's Range

14.52

 - 

15.10

52 Week Range

7.97

 - 

20.25

As of on the Shanghai Stock Exchange ∙ Minimum 15 minute delay

Pricing

Previous Close
14.99
Open
15.01
Volume
25,892,518
3M AVG Volume
1,055.13
Today's High
15.10
Today's Low
14.52
52 Week High
20.25
52 Week Low
7.97
Shares Out (MIL)
1,312.06
Market Cap (MIL)
19,825.25
Forward P/E
--
Dividend (Yield %)
0.26

Next Event

Q3 2019 Hangzhou Silan Microelectronics Co Ltd Earnings Release

Latest Developments

More

Hangzhou Silan Microelectronics to pay A shares div for FY 2017 on July 18

Hangzhou Silan Microelectronics unit to sell integrated circuit manufacturing equipment worth up to 30 mln yuan

Hangzhou Silan Microelectronics to pay cash dividend of 0.4 yuan per 10 shares (before tax) for 2017

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About Hangzhou Silan Microelectronics Co., Ltd

Hangzhou Silan Microelectronics Co., Ltd. is a China-based company principally engaged in the design, manufacture and sales of electronic components. The Company is also engaged in the importing and exporting of mechanical and electrical products. The Company's main products include integrated circuits, semiconductor discrete devices and light-emitting diode (LED) products. The Company mainly operates its businesses in Zhejiang Province, China.

Industry

Semiconductors

Contact Info

No.4 Huanggushan Road

+86.571.88210880

http://www.silan.com.cn

Executive Leadership

Xiangdong Chen

Chairman of the Board

Shaobo Zheng

Vice Chairman of the Board, General Manager

Weihong Fan

Vice Chairman of the Board

Yue Chen

Chief Financial Officer, Secretary of the Board

Zhigang Li

Deputy General Manager, Director

Key Stats

2.00 mean rating - 1 analysts
Sell
Hold
Buy
Revenue (MM, CNY)

2016

2.4K

2017

2.7K

2018

3.0K
EPS (CNY)

2016

0.080

2017

0.140

2018

0.130
Price To Earnings (TTM)
149.10
Price To Sales (TTM)
6.54
Price To Book (MRQ)
5.69
Price To Cash Flow (TTM)
--
Total Debt To Equity (MRQ)
67.61
LT Debt To Equity (MRQ)
11.49
Return on Investment (TTM)
0.57
Return on Equity (TTM)
0.33

Latest News

Latest News

BRIEF-Hangzhou Silan Microelectronics Plans To Issue Up To 800 Mln Yuan Bonds

* SAYS IT PLANS TO ISSUE UP TO 800 MILLION YUAN ($125.81 million) BONDS Source text in Chinese: https://bit.ly/2I32fkj Further company coverage: ($1 = 6.3587 Chinese yuan renminbi) (Reporting by Hong Kong newsroom)

BRIEF-Hangzhou Silan Microelectronics unit to sell integrated circuit manufacturing equipment worth up to 30 mln yuan

* Says co's Hangzhou-based integrated circuit unit will sell integrated circuit manufacturing equipment worth up to 30 million yuan

BRIEF-Hangzhou Silan Microelectronics to pay cash dividend of 0.4 yuan per 10 shares (before tax) for 2017

* Says it plans to pay cash dividend of 0.4 yuan per 10 shares (before tax) to shareholders for 2017

BRIEF-Hangzhou Silan Microelectronics and two units passes review of high-tech enterprise recognition

* Says it and two units passes review of high-tech enterprise recognition, to enjoy a tax preference of 15 percent for three years

BRIEF- Hangzhou Silan Microelectronics receives subsidy of 30 mln yuan

* Says it received subsidy of 30 million yuan in total from the government

BRIEF-Hangzhou Silan Microelectronics Plans Integrated Circuits Projects, Semiconductor JV

* SAYS IT SIGNS STRATEGIC FRAMEWORK AGREEMENT TO INVEST IN INTEGRATED CIRCUIT RELATED PROJECTS IN XIAMEN

BRIEF-Hangzhou Silan Microelectronics sees Q1 to Q3 of FY 2017 net profit up 100 pct to 130 pct

* Sees Q1 to Q3 of FY 2017 net profit to increase by 100 percent to 130 percent

BRIEF-Hangzhou Silan Microelectronics adopts new accounting policy

* Says it adopted new accounting policy disclosed by the Ministry of Finance on May 10, regarding subsidy

BRIEF-Hangzhou Silan Microelectronics scraps asset restructuring plan

* Says it scraps asset restructuring plan, share to resume trading on Aug 15

BRIEF-Hangzhou Silan Microelectronics scraps asset restructuring

Hangzhou Silan Microelectronics Co Ltd * Says it scraps asset restructuring Source text in Chinese: http://bit.ly/2vtuKit Further company coverage: (Reporting by Hong Kong newsroom)

BRIEF-Hangzhou Silan Microelectronics to pay A shares annual div for FY 2016 on May 19

* Says it will pay cash dividend of 0.025 yuan(before tax)/share for 2016 to shareholders of record on May 18

BRIEF-Hangzhou Silan Microelectronics' share trade to halt pending acquisition

* Says trading in shares to halt from May 12 pending announcement related to asset acquisition

BRIEF-Hangzhou Silan Microelectronics to pay cash 0.25 yuan per 10 shares as FY 2016 div payment

* Says it plans to pay cash 0.25 yuan per 10 shares as FY 2016 div payment

BRIEF-Hangzhou Silan Microelectronics reduces investment size of its project

* Says it reduces investment size of its project to 700 million yuan ($101.56 million) from 1.0 billion yuan

BRIEF-Hangzhou Silan Microelectronics sees FY2016 net profit to up by 110 pct to 160 pct

* Sees net profit for FY2016 to increase by 110 percent to 160 percent, compared to net profit of FY2015 (39.9 million yuan)

Quote and financial data from Refinitiv. Fund performance data provided by Lipper. All quotes delayed a minimum of 15 minutes.

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