January 11, 2017 / 5:23 PM / 8 months ago

BRIEF-STMicroelectronics and CWS partner to enhance RF SOI designs for communication chips

Jan 11 (Reuters) - STMicroelectronics NV :

* And CWS partner to close the gap between simulation and silicon measurements, further enhancing RF SOI designs for next generation communication chips

* Incorporates CWS’ SiPEX IN RF PDK H9 SOI FEM Source text for Eikon: Further company coverage: (Gdynia Newsroom)

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